US Patent Issued to Lite-On Technology on Jan. 13 for "Heat dissipation module" (Taiwanese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,963, issued on Jan. 13, was assigned to Lite-On Technology Corp. (Taipei, Taiwan).

"Heat dissipation module" was invented by Chien-Hsiung Tsao (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation module including an electronic component, a first heat dissipation component and a first thermal adhesive sheet, is provided. The electronic component has a first surface. The first heat dissipation component has a second surface facing the first face. The first thermal adhesive sheet is disposed between the first surface of the electronic component and the second surface of the first heat dissipation component, so as to fix the...