US Patent Issued to LITE-ON OPTO TECHNOLOGY (CHANGZHOU), LITE-ON TECHNOLOGY on July 15 for "Method of manufacturing light emitting package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,364,069, issued on July 15, was assigned to LITE-ON OPTO TECHNOLOGY (CHANGZHOU) Co. LTD. (Changzhou, China) and LITE-ON TECHNOLOGY Corp. (Taipei, Taiwan).

"Method of manufacturing light emitting package structure" was invented by Wei-Te Cheng (Taipei, Taiwan), Kuo-Ming Chiu (New Taipei, Taiwan), Kai-Chieh Liang (New Taipei, Taiwan) and Jie-Ting Tsai (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing the light emitting package structure is provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substr...