US Patent Issued to LIPAC on Feb. 10 for "Optical device package preparation method and optical device package" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,703, issued on Feb. 10, was assigned to LIPAC Co. LTD. (Seoul, South Korea).

"Optical device package preparation method and optical device package" was invented by Seong Wook Choi (Seoul, South Korea), Dong Woo Park (Seoul, South Korea) and Young June Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor package. The semiconductor package includes: a semiconductor chip; a mold configured to encapsulate the chip; a redistribution layer; and an optical device electrically connected to the chip through the redistribution layer. The mold is formed with an optical path passing through the mold, and ligh...