US Patent Issued to Linxens Holding on July 15 for "Electrical circuit for a smart card chip module, smart card chip module and method for manufacturing a smart card chip module" (French Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,361,257, issued on July 15, was assigned to Linxens Holding (Mantes-la-Jolie, France).

"Electrical circuit for a smart card chip module, smart card chip module and method for manufacturing a smart card chip module" was invented by Yean Wei Yeap (Mantes-la-Jolie, France) and Wen Qiang Chin (Mantes-la-Jolie, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "Electrical circuit for a smart card chip module, including an insulating layer having a front main face and a rear main face. An antenna is made in a first conductive layer laying on the rear main face. This antenna extends over an antenna area delimited by a peripheral edge. The antenna includes a...