US Patent Issued to LINXENS HOLDING on Feb. 3 for "Pre-package for a printed circuit board for a smart card and method of forming same" (Thai Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,263, issued on Feb. 3, was assigned to LINXENS HOLDING (Mantes-la-Jolie, France).

"Pre-package for a printed circuit board for a smart card and method of forming same" was invented by Khiengkrai Khusuwan (Bang pa-in, Thailand) and Anupont Phakping (Bang pa-in, Thailand).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention refers to a pre-package for a flexible printed circuit board for a smartcard. The pre-package comprises a flexible printed circuit board including one or more non-planar circuit portions; a first layer of a first material at least partially covering a first side of the flexible printed circuit board so as to form a pl...