ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,768, issued on April 29, was assigned to LINTEC Corp. (Tokyo).
"Method of manufacturing laminate" was invented by Isao Ichikawa (Tokyo), Hidekazu Nakayama (Tokyo) and Yosuke Sato (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying, to a substrate, the film-form firing material on the support sheet; peeling off t...