ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,260, issued on April 29, was assigned to LINTEC Corp. (Tokyo).
"Adhesion device and adhesion method" was invented by Kazuhiro Azuhata (Tokyo) and Akihiro Mitaka (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An attachment apparatus includes: a guide mechanism provided along an attaching direction on an adhesion target surface; a slider supported by the guide mechanism in a manner movable in the attaching direction; a shaft body rotatably supported by the slider; a biasing unit that applies a biasing force in a rotation direction to the shaft body; a connector extending from the shaft body in a radial direction of the shaft body; and an elastic...