US Patent Issued to LIGITEK ELECTRONICS on March 25 for "Touch light-emitting module having hallowed portion for incapsulation resin and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,260,049, issued on March 25, was assigned to LIGITEK ELECTRONICS Co. LTD. (New Taipei, Taiwan).

"Touch light-emitting module having hallowed portion for incapsulation resin and manufacturing method thereof" was invented by Yi-Wen Chen (New Taipei, Taiwan), Wen-Chung Chou (New Taipei, Taiwan) and I-Hsin Tung (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A touch light-emitting module having hallowed portion for incapsulation resin and a manufacturing method thereof are disclosed. The touch light-emitting module includes a printed circuit board and a touch-control conductor. The printed circuit board has a top surface on which a touch...