ALEXANDRIA, Va., July 30 -- United States Patent no. D1,086,507, issued on July 29, was assigned to LIGITEK ELECTRONICS Co. LTD. (New Taipei, Taiwan).
"Light emitting diode package" was invented by Yi-Wen Chen (New Taipei, Taiwan), Wen-Chung Chou (New Taipei, Taiwan) and I-Hsin Tung (New Taipei, Taiwan).
The patent was filed on Jan. 10, 2025, under Application No. D/983,473.
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