US Patent Issued to LG INNOTEK on Nov. 11 for "Resin composition for semiconductor package, resin coated copper, and circuit board comprising same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,466,936, issued on Nov. 11, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Resin composition for semiconductor package, resin coated copper, and circuit board comprising same" was invented by Yong Suk Kim (Seoul, South Korea) and Jeong Han Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition for a semiconductor package according to an embodiment includes a resin composition that is a composite of a resin and a filler disposed in the resin, wherein the filler has a content in a range of 68 wt % to 76 wt % in the resin composition, wherein the filler includes a first filler group composed of fillers having...