US Patent Issued to LG INNOTEK on March 18 for "Circuit board including a buffer layer for improving" (South Korean Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,489, issued on March 18, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Circuit board including a buffer layer for improving" was invented by Yong Suk Kim (Seoul, South Korea), Jeong Han Kim (Seoul, South Korea) and Moo Seong Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board according to an embodiment comprises: an insulation layer; a circuit pattern disposed on the upper surface or under the lower surface of the insulation layer; and a buffer layer disposed on at least one surface of the upper surface and the lower surface of the insulation layer, wherein the buffer layer includes carbon, nitrogen, ...