ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,475, issued on June 24, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).
"Substrate unit and substrate assembly, and camera module using same" was invented by Hyun Woo Ryou (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part ...