US Patent Issued to LG INNOTEK on June 10 for "Flexible printed circuit board, COF module, and electronic device comprising the same" (South Korean Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,817, issued on June 10, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Flexible printed circuit board, COF module, and electronic device comprising the same" was invented by Eon Jong Lee (Seoul, South Korea), Dong Chan Kim (Seoul, South Korea) and Ki Tae Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flexible printed circuit board includes: a substrate; and a circuit pattern disposed on the substrate, wherein the substrate includes a chip mounting region, and the circuit pattern includes a wiring portion and a pad portion, wherein the circuit pattern includes: a first circuit pattern including a first-first pad...