US Patent Issued to LG INNOTEK on July 29 for "Resin coated copper and circuit board including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,229, issued on July 29, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Resin coated copper and circuit board including the same" was invented by Jeong Han Kim (Seoul, South Korea), Yong Suk Kim (Seoul, South Korea) and Moo Seong Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin coated copper according to an embodiment includes: an insulating layer including a resin and a filler dispersed in the resin; and a copper foil layer disposed on the insulating layer, wherein the insulating layer has a plurality of pores formed on a surface in contact with the copper foil layer, and the plurality of pores have a width ...