US Patent Issued to LG INNOTEK on July 29 for "Camera module including a housing with an adhesion surface" (South Korean Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,375,790, issued on July 29, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Camera module including a housing with an adhesion surface" was invented by Ji Hwan Park (Seoul, South Korea) and Myoung Jin An (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "One embodiment relates to a camera module comprising: a housing; a first printed circuit board having an image sensor mounted thereon, and loaded in the housing such that the image sensor is accommodated in the housing; a second printed circuit board and a third printed circuit board sequentially arranged on the lower part of the first printed circuit board in the vertical dir...