US Patent Issued to LG INNOTEK on July 1 for "Heat dissipation module and power conversion device comprising same" (South Korean Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,322, issued on July 1, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Heat dissipation module and power conversion device comprising same" was invented by Mi Sun Lee (Seoul, South Korea), Sang Hun An (Seoul, South Korea) and Ji Hwan Jeon (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation module comprises: a heating element; a heat dissipation member disposed on one side of the heating element and including a first plate and a second plate; a third plate disposed on one side of the heating element; and a heat transfer path for transferring the heat generated from the heating element to the heat dissipatio...