US Patent Issued to LG INNOTEK on July 1 for "Circuit board including a core layer provided with plurality of insulating layers" (South Korean Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,288, issued on July 1, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Circuit board including a core layer provided with plurality of insulating layers" was invented by Myung Jae Kwon (Seoul, South Korea), Sang Hyuck Nam (Seoul, South Korea) and Jin Hyoung Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package according to an embodiment includes a first insulating layer including a through hole; an insulating member disposed in the through hole of the first insulating layer; a first electrode layer disposed on the insulating member; a second insulating layer disposed on the first electrode layer; a...