US Patent Issued to LG INNOTEK on Dec. 16 for "Package substrate" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,548, issued on Dec. 16, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Package substrate" was invented by Il Sik Nam (Seoul, South Korea), Dong Keun Lee (Seoul, South Korea) and Hye Jin Jo (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate according to an embodiment includes an insulating layer; a first outer circuit pattern disposed on an upper surface of the insulating layer; a second outer circuit pattern disposed under a lower surface of the insulating layer; a first connection portion disposed on an upper surface of a first-first circuit pattern of the first outer circuit pattern; a first contact ...