US Patent Issued to LG INNOTEK on April 8 for "Flexible printed circuit board, COF module, and electronic device comprising the same" (South Korean Inventor)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,274,000, issued on April 8, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Flexible printed circuit board, COF module, and electronic device comprising the same" was invented by Sang Hun Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flexible printed circuit board according to an embodiment includes a substrate, a circuit pattern disposed on the substrate, and a protective layer on the circuit pattern, wherein the substrate includes a chip mounting region, the circuit pattern includes a first circuit pattern and a second circuit pattern connected to a chip of the chip mounting region, the second circuit pattern inc...