ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,413, issued on Oct. 7, was assigned to LG Energy Solution Ltd. (Seoul, South Korea).
"Pouch molding apparatus and method" was invented by Chung Hee Lee (Daejeon, South Korea), Beom Su Kim (Daejeon, South Korea), Yong Nam Kim (Daejeon, South Korea) and Dong Hyeuk Park (Daejeon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A pouch molding apparatus and method involves deforming a pouch so that a larger amount of clearance is secured to increase the capacity of the pouch, thereby improving the pouch molding process to increase the depth and capacity of a pouch cup part. The pouch molding apparatus includes a die and a punch. The die has a ...