ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,508,752, issued on Dec. 30, was assigned to LG Energy Solution Ltd. (Seoul, South Korea).
"Apparatus for molding pouch" was invented by Heon Gi Seok (Daejeon, South Korea) and Dae Hyung Kang (Daejeon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for molding a pouch, which includes: a transfer device configured to transfer a pouch film; a molding device configured to press a top surface of the pouch film to mold an accommodation part for accommodating an electrode assembly; and an inspection device configured to calculate a depth value of the accommodation part formed in the pouch film detect defects. The inspection device incl...