US Patent Issued to LG Electronics on Sept. 23 for "Heat pump" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,170, issued on Sept. 23, was assigned to LG Electronics Inc. (Seoul, South Korea).

"Heat pump" was invented by Youngmin Lee (Seoul, South Korea), Jihyeong Ryu (Seoul, South Korea), Eunjun Cho (Seoul, South Korea) and Minsoo Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump is provided that includes a first pipe in which a first refrigerant flows; a second pipe disposed at a side of the first pipe and in which a second refrigerant flows; a first heat exchanger connected with the first pipe and the second pipe and in which the first refrigerant exchanges heat with the second refrigerant; a boiler connected with the fi...