US Patent Issued to LG Electronics on July 22 for "Module for removing misassembled semiconductor light-emitting element, and method using same to remove misassembled semiconductor light-emitting element" (South Korean Inventor)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,130, issued on July 22, was assigned to LG Electronics Inc. (Seoul, South Korea).

"Module for removing misassembled semiconductor light-emitting element, and method using same to remove misassembled semiconductor light-emitting element" was invented by Juchan Choi (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A removal module for removing a mis-assembled semiconductor light emitting diode includes a housing having an inner space formed by an upper plate having a nozzle hole and a lower plate spaced apart from the upper plate; a fluid supply part configured to supply a fluid outside the housing to the inner space; and a fluid con...