US Patent Issued to LG Electronics on Jan. 27 for "Antenna module implemented in multi-layer package and electronic device comprising the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,288, issued on Jan. 27, was assigned to LG Electronics Inc. (Seoul, South Korea).

"Antenna module implemented in multi-layer package and electronic device comprising the same" was invented by Yusuhk Suh (Seoul, South Korea), Dongik Lee (Seoul, South Korea) and Seungmin Woo (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first s...