ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,379,203, issued on Aug. 5, was assigned to LG Electronics Inc. (Seoul, South Korea).
"Thickness measurement device" was invented by Seohyeon Jo (Seoul, South Korea) and Daecheol Lim (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thickness measurement device can include a stage module, an upper optical module above the stage module and spaced from the stage module in a Z-axis direction, a lower optical module below the stage module and spaced from the stage module in the Z-axis direction. The stage module has a larger area than the upper optical module and the lower optical module, a Y-axis movement mechanism for moving the stage alo...