US Patent Issued to LG CHEM on Sept. 23 for "Thermoplastic resin composition, method of preparing the same, and molded article including the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,421,381, issued on Sept. 23, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Thermoplastic resin composition, method of preparing the same, and molded article including the same" was invented by Jung Tae Park (Daejeon, South Korea), Dae Woo Lee (Daejeon, South Korea), Jae Bum Seo (Daejeon, South Korea), Gyu Sun Kim (Daejeon, South Korea) and Jiuk Jang (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermoplastic resin composition of the present invention includes 65 to 85% by weight of a heat-resistant copolymer (A) containing 76 to 92% by weight of a (meth)acrylic acid alkyl ester compound, 1 to 8% by weight of an N-substitu...