US Patent Issued to LG CHEM on Oct. 21 for "Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,490, issued on Oct. 21, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same" was invented by Minsu Jeong (Daejeon, South Korea), You Jin Kyung (Daejeon, South Korea), Byung Ju Choi (Daejeon, South Korea), Woo Jae Jeong (Daejeon, South Korea), Kwang Joo Lee (Daejeon, South Korea) and Eunbyurl Cho (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility whi...