ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,877, issued on Oct. 14, was assigned to LG Chem Ltd. (Seoul, South Korea).
"Thermoplastic resin composition" was invented by Tae Hee Kim (Daejeon, South Korea), Ki Soo Lee (Daejeon, South Korea), Eun Ji Shin (Daejeon, South Korea), Seok Pil Sa (Daejeon, South Korea), Seul Ki Im (Daejeon, South Korea), Hyun Mo Lee (Daejeon, South Korea), Ji Hyun Park (Daejeon, South Korea), Yun Kon Kim (Daejeon, South Korea) and Seung Jung Yu (Daejeon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a thermoplastic resin composition including a polyolefin-polystyrene-based multi-block copolymer having a structure in which a...