US Patent Issued to LG CHEM on Nov. 4 for "Adhesive composition for dicing tape and dicing tape including the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,460,113, issued on Nov. 4, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Adhesive composition for dicing tape and dicing tape including the same" was invented by Da Ae Kim (Daejeon, South Korea), Ji Ho Han (Daejeon, South Korea), Kwang Joo Lee (Daejeon, South Korea), Eun Yeong Kim (Daejeon, South Korea) and Mi Jang (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composit...