US Patent Issued to LG CHEM on Nov. 11 for "Polyamide resin, and polymer film, resin laminate using the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,466,917, issued on Nov. 11, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Polyamide resin, and polymer film, resin laminate using the same" was invented by Il Hwan Choi (Daejeon, South Korea), Soonyong Park (Daejeon, South Korea), Bi Oh Ryu (Daejeon, South Korea), Young Ji Tae (Daejeon, South Korea) and Youngseok Park (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a polyamide resin in which an average particle size of individual crystals measured by a small-angle X-ray scattering apparatus is 8.0 nm or less, and a UV-cut slope (dT/dLambda) measured for a specimen having a thickness of 45 micro...