US Patent Issued to LG CHEM on May 27 for "Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same" (South Korean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,313,973, issued on May 27, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same" was invented by Jeong Wook Mun (Daejeon, South Korea), Kong Kyeom Kim (Daejeon, South Korea), Woo Jae Jeong (Daejeon, South Korea), Jee Hyeon Hwang (Daejeon, South Korea), Eun Byurl Cho (Daejeon, South Korea) and Jeong Hyuk Ahn (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides an insulating layer for a multilayer printed circuit board, a multilayer printed circuit board including the same, an...