US Patent Issued to LG CHEM on June 17 for "Thermoplastic resin composition and molded article including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,331,185, issued on June 17, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Thermoplastic resin composition and molded article including the same" was invented by Wangrae Joe (Daejeon, South Korea), Daeun Sung (Daejeon, South Korea), Tae Hoon Kim (Daejeon, South Korea), Chun Ho Park (Daejeon, South Korea), Yong Hee An (Daejeon, South Korea) and Jeongmin Jang (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a thermoplastic resin composition and a molded article including the same. The thermoplastic resin composition includes 10 to 70% by weight of a graft copolymer (A) including an acrylate-aromat...