ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,013, issued on July 15, was assigned to LG Chem Ltd. (Seoul, South Korea).
"Curable composition" was invented by Jeong Hyun Lee (Daejeon, South Korea), Do Yeon Kim (Daejeon, South Korea), Yang Gu Kang (Daejeon, South Korea), Shin Hee Jun (Daejeon, South Korea), Ha Na Lee (Daejeon, South Korea) and Ho Yeon Son (Daejeon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present application relates to a resin composition or a use thereof. In the present application, it is possible to provide a resin composition or a cured body thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity. A...