ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,555, issued on Jan. 27, was assigned to LG CHEM Ltd. (Seoul, South Korea).
"Thermoplastic resin composition, method of preparing the same, and molded article manufactured using the same" was invented by Insoo Kim (Daejeon, South Korea), Hyung Sub Lee (Daejeon, South Korea), Dae Woo Lee (Daejeon, South Korea), Jung Tae Park (Daejeon, South Korea), Suk Jo Choi (Daejeon, South Korea), Mincheol Ju (Daejeon, South Korea), Minseung Shin (Daejeon, South Korea), Sungwon Hong (Daejeon, South Korea) and Hyun Jun Ryu (Daejeon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a thermoplastic resin composition includin...