ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,593, issued on Jan. 27, was assigned to LG Chem Ltd. (Seoul, South Korea).
"Encapsulation composition" was invented by Seung Min Lee (Daejeon, South Korea), Yeong Bong Mok (Daejeon, South Korea), Sung Nam Moon (Daejeon, South Korea) and Se Woo Yang (Daejeon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an encapsulation composition, an encapsulation film comprising the same, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation composition capable of effectively blocking moisture or oxygen introduced ...