ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,384,913, issued on Aug. 12, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Thermoplastic resin composition and molded article manufactured using the same" was invented by Eun Jung Choi (Daejeon, South Korea), Seo Hwa Kim (Daejeon, South Korea), Byoung Il Kang (Daejeon, South Korea), Seongkyun Kim (Daejeon, South Korea) and Yeongmin Kim (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a thermoplastic resin composition having excellent compatibility between a base resin and additives that may prevent aggregation of a metal pigment, and a molded article including the same. Also disclosed is a molded article manufacture...