US Patent Issued to LG CHEM on April 29 for "Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,564, issued on April 29, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same" was invented by Youngsam Kim (Daejeon, South Korea), You Jin Kyung (Daejeon, South Korea), Kwang Joo Lee (Daejeon, South Korea), Minsu Jeong (Daejeon, South Korea), Junghak Kim (Daejeon, South Korea) and Ju Hyeon Kim (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resi...