ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,225, issued on Oct. 21, was assigned to Lextar Electronics Corp. (Hsinchu, Taiwan).
"Light emitting diode packaging structure" was invented by Chih-Hao Lin (Hsinchu, Taiwan), Jo-Hsiang Chen (Hsinchu, Taiwan), Shih-Lun Lai (Hsinchu, Taiwan), Min-Che Tsai (Hsinchu, Taiwan) and Jian-Chin Liang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The light emitting diode packaging structure includes a flexible substrate, micro light emitting elements disposed on the flexible substrate, a conductive pad, a redistribution layer, and an electrode pad. The micro light emitting elements have a first surface facing to the flexible substrate and a s...