US Patent Issued to Lextar Electronics on July 22 for "Diode package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,443, issued on July 22, was assigned to Lextar Electronics Corp. (Hsinchu, Taiwan).

"Diode package structure and manufacturing method thereof" was invented by Yu-Jing Fang (Hsinchu, Taiwan), Hsiang-Chun Hsu (Hsinchu, Taiwan) and Cheng-Ping Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A diode package structure includes a substrate, at least one diode chip and an opaque encapsulating layer. The substrate has an electrically conductive layer. At least one diode chip is mounted on the substrate and electrically connected to the electrically conductive layer. The opaque encapsulating layer has a cap portion and a sidewall portion...