ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,853, issued on April 22, was assigned to Lextar Electronics Corp. (Hsinchu, Taiwan).
"LED package structure" was invented by Chien-Hsin Tu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting diode (LED) package structure include an electrically-insulated frame, a trough, a LED chip, a fluorescent colloid and at least two spacing members. The electrically-insulated frame has a surface with four corners. The trough is recessed in the surface. The LED chip is located in the trough. The fluorescent colloid is filled within the trough to cover the LED chip. The spacing members protrude from two of the four corners on the surfa...