ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,834, issued on July 15, was assigned to LEOTEK Corp. (Taipei, Taiwan).
"Circuit board module and manufacturing method thereof" was invented by Cheng-Ta Tsai (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board module includes a first circuit board, a second circuit board and a connection layer. The first circuit board includes two first conductive layers, a first dielectric core layer and a first conductive via, the first dielectric core layer is formed between the two first conductive layers, and the first conductive via connects the two first conductive layers. The second circuit board includes two second conductive layer...