ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,264, issued on July 29, was assigned to LENOVO (SINGAPORE) PTE. LTD. (Singapore).
"Cooling module and electronic apparatus" was invented by Junki Hashiba (Yokohama, Japan), Masahiro Kitamura (Yokohama, Japan) and Shusaku Tomizawa (Yokohama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling module includes a fan, a heat sink, and a first heat pipe and a second heat pipe that are connected to a first surface of the heat sink. The heat sink includes a valley portion in which the second surface is recessed toward a side of the first surface, a first mountain portion that is between the valley portion and the air introduction surface and has...