ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,452, issued on May 27, was assigned to LENOVO (BEIJING) Ltd. (Beijing).
"Heat dissipating structure" was invented by Xintong Ding (Beijing), Huanhuan Xue (Beijing) and Ting Tian (Beijing).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipating structure includes a cold plate configured to exchange heat with a heat dissipating device; a liquid pipe disposed at both ends of the cold plate, the liquid pipe being configured to transport heat conducting liquid; and a deformation structure configured in the liquid pipe and located at a position corresponding to the cold plate, wherein the deformation structure deforms as an ambient temperature ch...