US Patent Issued to LENOVO (BEIJING) on March 18 for "Heat dissipation device and electronic equipment" (Chinese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,522, issued on March 18, was assigned to LENOVO (BEIJING) Ltd. (Beijing).

"Heat dissipation device and electronic equipment" was invented by Xintong Ding (Beijing), Puyu Yao (Beijing) and Ting Tian (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation device includes: a rigid tube, including a first cavity; a first capillary structure, at least a portion of the first capillary structure being positioned within the first cavity; a flexible tube, including a second cavity, the flexible tube being more flexible than the rigid tube; and a second capillary structure, at least a portion of the second capillary structure being positio...