US Patent Issued to LENOVO (BEIJING) on Aug. 26 for "Heat dissipation device and electronic apparatus" (Chinese Inventor)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,280, issued on Aug. 26, was assigned to LENOVO (BEIJING) Ltd. (Beijing).

"Heat dissipation device and electronic apparatus" was invented by Jiajing Bai (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation device includes a body and at least two first capillary structures. The body includes an accommodation chamber. The accommodation chamber includes a heat dissipation medium. The at least two first capillary structures are stripe-shaped and arranged in the accommodation chamber along a flow direction of the heat dissipation medium. A first space is formed between two neighboring first capillary structures. A liquid heat dissipa...