US Patent Issued to LENOVO (BEIJING) on April 22 for "Sound absorption device, heat dissipation device and server chassis" (Chinese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,781, issued on April 22, was assigned to LENOVO (BEIJING) Ltd. (Beijing).

"Sound absorption device, heat dissipation device and server chassis" was invented by Haiyan Chen (Beijing) and Yewei Cao (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application discloses a sound absorbing device to be placed in an airflow that is in a first direction. The sound absorbing device includes a housing; a plurality of sound absorbing units disposed in the housing to be passed by the airflow, the plurality of sound absorbing units being arranged in a direction perpendicular to the first direction, any two adjacent sound absorbing units being s...