US Patent Issued to LEICA BIOSYSTEMS MELBOURNE on March 4 for "Thermal module for a sample processing assembly" (Australian Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,241,817, issued on March 4, was assigned to LEICA BIOSYSTEMS MELBOURNE PTY LTD (Mount Waverley, Australia).

"Thermal module for a sample processing assembly" was invented by Peter Toogood (Mitcham, Australia), Kenneth Heng-Chong Ng (Donvale, Australia), Anthony Favaloro (Richmond, Australia), Stephen John Bagnato (Mt. Waverley, Australia) and Gregory William Boyes (Croydon, Australia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal system for controllably altering a temperature within a reaction chamber in a sample processing assembly is described. The reaction chamber is bounded by a substrate and cover member in the sample processing assembly....