US Patent Issued to LEDVANCE on Oct. 7 for "Light emitting diode filament including chip scale package light emitting diodes to reduce the amount of phosphor that is integrated into the filament" (Chinese, American Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,130, issued on Oct. 7, was assigned to LEDVANCE LLC (Wilmington, Mass.).

"Light emitting diode filament including chip scale package light emitting diodes to reduce the amount of phosphor that is integrated into the filament" was invented by Xinrong Wang (Shenzhen, China), Tianzheng Jiang (Shenzhen, China) and Ming Li (Acton, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting filament diode that includes a filament substrate; a plurality of light emitting diodes (LEDs) electrically connected and disposed along a length of the filament substrate; and a phosphorus encapsulant present in direct contact with an upper surface and sidewa...