US Patent Issued to Leading Interconnect Semiconductor Technology Qinhuangdao, Leading Interconnect Semiconductor Technology (ShenZhen) on Sept. 16 for "Packaged circuit structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,989, issued on Sept. 16, was assigned to Leading Interconnect Semiconductor Technology Qinhuangdao Co. Ltd. (Qinhuangdao, China) and Leading Interconnect Semiconductor Technology (ShenZhen) Co. Ltd. (Shenzhen, China).

"Packaged circuit structure" was invented by Chun-Chieh Huang (Taoyuan, Taiwan) and Chin-Ming Liu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package circuit structure includes a multilayer circuit board, an electronic component, and an insulating layer. The multilayer circuit board includes a metal portion and an opening. The opening is extending from a first side of the multilayer circuit board toward the secon...