US Patent Issued to LAPIS Technology on June 24 for "Semiconductor device, electronic device, and method of setting characteristics of electronic device" (Japanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,426, issued on June 24, was assigned to LAPIS Technology Co. Ltd. (Yokohama, Japan).

"Semiconductor device, electronic device, and method of setting characteristics of electronic device" was invented by Ryuu Soga (Yokohama, Japan) and Tomoyuki Maeda (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a storage circuit configured to be connected to a regulator circuit having characteristics to be identified using one or more values and store values identifying characteristics of the regulator circuit; and an electronic fuse controller including an input configured to be connected to an electronic fuse circ...